Plane-type heat-dissipating structure with high heat-dissipating effect and method for
manufacturing the same

ABSTRACT

A plane-type heat-dissipating structure with high heat-dissipating effect includes a first heat-dissipating unit and a second heat-dissipating unit. The first heat-dissipating unit has an evacuated hollow heat-dissipating body, a plurality of supports integratedly formed in the hollow heat-dissipating body in order to divide an inner space of the hollow heat-dissipating body into a plurality of receiving spaces, and a plurality of microstructures integratedly formed on an inner surface of the hollow heat-dissipating body. Work liquid is filled into the receiving spaces. The second heat-dissipating unit is integratedly formed on an outer surface of the first heat-dissipating unit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a plane-type heat-dissipating structureand a method for manufacturing the same, in particular, to a plane-typeheat-dissipating structure with high heat-dissipating effect and amethod for manufacturing the same.

2. Description of Related Art

Cooling or heat removal has been one of the major obstacles of theelectronic industry. The heat dissipation increases with the scale ofintegration, the demand for higher performance, and the increase ofmulti-functional applications. The development of high performance heattransfer devices becomes one of the major development efforts of theindustry. Heat pipes have excellent heat transfer performance due totheir low thermal resistance, and are therefore an effective means fortransfer or dissipation of heat from heat sources. Currently, heat pipesare widely used for removing heat from heat-generating components suchas central processing units (CPUs) of computers.

A heat pipe is usually a vacuum casing containing therein a workingmedium, which is employed to carry, under phase transitions betweenliquid state and vapor state, thermal energy from an evaporator sectionto a condenser section of the heat pipe. Preferably, a wick structure isprovided inside the heat pipe, lining an inner wall of the casing, fordrawing the working medium back to the evaporator section after it iscondensed at the condenser section. In operation, the evaporator sectionof the heat pipe is maintained in thermal contact with a heat-generatingcomponent. The working medium contained at the evaporator sectionabsorbs heat generated by the heat-generating component and then turnsinto vapor and moves towards the condenser section where the vapor iscondensed into condensate after releasing the heat into ambientenvironment. Due to the difference in capillary pressure which developsin the wick structure between the two sections, the condensate is thenbrought back by the wick structure to the evaporator section where it isagain available for evaporation.

However, the design of the positions of the evaporator section and thecondenser section still has improvement space.

SUMMARY OF THE INVENTION

In view of the aforementioned issues, the present invention provides aplane-type heat-dissipating structure with high heat-dissipating effectand a method for manufacturing the same. The present invention canachieve high heat-dissipating effect by matching two integratedheat-dissipating units. One of the two heat-dissipating units has anevacuated hollow heat-dissipating body, a plurality of supportsintegratedly formed in the hollow heat-dissipating body in order todivide an inner space of the hollow heat-dissipating body into aplurality of receiving spaces, and a plurality of microstructuresintegratedly formed on an inner surface of the hollow heat-dissipatingbody. Work liquid is filled into the receiving spaces. The secondheat-dissipating unit has a plurality of exposed heat-dissipating fins.

To achieve the above-mentioned objectives, the present inventionprovides a plane-type heat-dissipating structure with highheat-dissipating effect, including: a first heat-dissipating unit and asecond heat-dissipating unit. The first heat-dissipating unit has anevacuated hollow heat-dissipating body, a plurality of supportsintegratedly formed in the hollow heat-dissipating body in order todivide an inner space of the hollow heat-dissipating body into aplurality of receiving spaces, and a plurality of microstructuresintegratedly formed on an inner surface of the hollow heat-dissipatingbody. Work liquid is filled into the receiving spaces. The secondheat-dissipating unit is integratedly formed on an outer surface of thefirst heat-dissipating unit.

To achieve the above-mentioned objectives, the present inventionprovides a method for manufacturing a plane-type heat-dissipatingstructure with high heat-dissipating effect, including: using anextruding mold to integratedly extrude a first heat-dissipating unit anda second heat-dissipating unit, wherein the first heat-dissipating unithas a hollow heat-dissipating body, a plurality of supports integratedlyformed in the hollow heat-dissipating body in order to divide an innerspace of the hollow heat-dissipating body into a plurality of receivingspaces, and a plurality of microstructures integratedly formed on aninner surface of the hollow heat-dissipating body, and the secondheat-dissipating unit is integratedly formed on an outer surface of thefirst heat-dissipating unit; closing one end of the firstheat-dissipating unit; filling work liquid into the receiving spaces;and then extracting air from the receiving spaces and closing otheropposite end of the first heat-dissipating unit to make the hollowheat-dissipating body become an evacuated hollow heat-dissipating body.

Therefore, the present invention has the following advantages:

1. The work liquid may generate capillarity by the design of themicrostructures, so that the work liquid may flow back quickly to aheat-generating area to absorb heat. The microstructures can be anyregular shapes (such as rectangular prism, a cylinder, a taper or adovetailed shape) and any irregular shape according to different designrequirement.

2. Each heat-dissipating fin has a rectangular prism, a cylinder, ataper or a dovetailed shape according to different design requirement.

3. The hollow heat-dissipating body provides the second surface, so thatthe heat-generating element is smoothly disposed on the second surfacein order to increase heat-conducting efficiency. Hence, heat generatedfrom the heat-generating element may be absorbed by the second surface,and the heat is dissipated by the heat-dissipating fins that are formedon the first surface.

4. A third heat-dissipating unit is retained on the secondheat-dissipating unit by matching the dovetailed retaining bodies of thethird heat-dissipating unit and the dovetailed heat-dissipating fins ofthe second heat-dissipating unit.

5. A heat-generating element is retained on the second heat-dissipatingunit by matching the dovetailed bottom seat of the heat-generatingelement and the dovetailed heat-dissipating fins of the secondheat-dissipating unit.

In order to further understand the techniques, means and effects thepresent invention takes for achieving the prescribed objectives, thefollowing detailed descriptions and appended drawings are herebyreferred, such that, through which, the purposes, features and aspectsof the present invention can be thoroughly and concretely appreciated;however, the appended drawings are merely provided for reference andillustration, without any intention to be used for limiting the presentinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective, schematic view of the plane-typeheat-dissipating structure with high heat-dissipating effect accordingto the first embodiment of the present invention;

FIG. 1B is a partial enlarged view of the dotted line area in FIG. 1A;

FIG. 2 is a partial enlarged view of the plane-type heat-dissipatingstructure with high heat-dissipating effect according to the secondembodiment of the present invention;

FIG. 3 is a partial enlarged view of the plane-type heat-dissipatingstructure with high heat-dissipating effect according to the thirdembodiment of the present invention;

FIG. 4 is a partial enlarged view of the plane-type heat-dissipatingstructure with high heat-dissipating effect according to the fourthembodiment of the present invention;

FIG. 5 is a partial enlarged view of the plane-type heat-dissipatingstructure with high heat-dissipating effect according to the fifthembodiment of the present invention;

FIG. 6 is a perspective, schematic view of the plane-typeheat-dissipating structure with high heat-dissipating effect accordingto the sixth embodiment of the present invention;

FIG. 7 is a perspective, schematic view of the plane-typeheat-dissipating structure with high heat-dissipating effect accordingto the seventh embodiment of the present invention;

FIG. 8 is a perspective, schematic view of the plane-typeheat-dissipating structure with high heat-dissipating effect accordingto the eighth embodiment of the present invention;

FIG. 9 is a perspective, schematic view of the plane-typeheat-dissipating structure with high heat-dissipating effect accordingto the ninth embodiment of the present invention;

FIG. 10A is a flowchart of the method for manufacturing the plane-typeheat-dissipating structure with high heat-dissipating effect accordingto the present invention;

FIG. 10B is a cross-sectional, schematic view of the extruding moldaccording to the present invention;

FIG. 10C is a partial, perspective, schematic view of the spindle of theextruding mold according to the present invention; and

FIG. 10D is a partial, enlarged view of the extruding mold according tothe present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1A and 1B (FIG. 1B is an enlarged view of the dottedline range in FIG. 1A), the first embodiment of the present inventionprovides a plane-type heat-dissipating structure with highheat-dissipating effect, including: a first heat-dissipating unit 1 aand a second heat-dissipating unit 2 a.

The first heat-dissipating unit 1 a has an evacuated hollowheat-dissipating body 10 a (FIG. 1A shows central part of the hollowheat-dissipating body 10 a), a plurality of supports 11 a integratedlyformed in the hollow heat-dissipating body 10 a in order to divide aninner space of the hollow heat-dissipating body 10 a into a plurality ofreceiving spaces 100 a, and a plurality of microstructures 12 aintegratedly formed on an inner surface of the hollow heat-dissipatingbody 10 a. In addition, the first heat-dissipating unit 1 a can be madeof aluminum alloy such as 1070 series, 6063 series or 6061 series etc.The first heat-dissipating unit 1 a has a plurality of grooves 120 aformed in the receiving spaces 100 a, and each groove 120 a is betweenevery two adjacent microstructures 12 a. In the first embodiment, eachmicrostructure 12 a has a rectangular prism and work liquid (not shown)is filled into the receiving spaces 100 a.

Moreover, the second heat-dissipating unit 2 a is integratedly formed onan outer surface of the first heat-dissipating unit 1 a. The secondheat-dissipating unit 2 a can be made of aluminum alloy such as 1070series, 6063 series or 6061 series etc. The second heat-dissipating unit2 a has a plurality of heat-dissipating fins 20 a. In the firstembodiment, each heat-dissipating fin 20 a has a rectangular prism.However, the rectangular prism is just an example, and it does not limitthe present invention. For example, each heat-dissipating fin 20 a canbe a cylinder, a taper, a dovetailed shape, or any shape in the presentinvention.

Therefore, the work liquid may generate capillarity by the design of themicrostructures 12 a, so that the work liquid may flow back quickly to aheat-generating area to absorb heat. In other words, when the plane-typeheat-dissipating structure is evacuated, the work liquid would vaporquickly after absorbing heat generated by a heat-generating area. Theheat absorbed by the work liquid (the vapor) may be dissipated (orcooling) by the first heat-dissipating unit and the secondheat-dissipating unit, and at the same time the work liquid is coolingand flow back to the heat-generating area to absorb heat again bycapillarity in order to achieve the circulation of heat absorption andheat extraction.

Referring to FIG. 2, the difference between the second embodiment andthe first embodiment is that: in the second embodiment, eachmicrostructure 12 b has a cylinder.

Referring to FIG. 3, the difference between the third embodiment and theabove-mentioned embodiments is that: in the third embodiment, eachmicrostructure 12 c has a taper.

Referring to FIG. 4, the difference between the fourth embodiment andthe above-mentioned embodiments is that: in the fourth embodiment, eachmicrostructure 12 d has a dovetailed shape.

Referring to FIG. 5, the difference between the fifth embodiment and theabove-mentioned embodiments is that: in the fifth embodiment, eachmicrostructure 12 e has an irregular shape.

However, the above-mentioned shape of each microstructure is just anexample, and it does not limit the present invention. Any regular shapessuch as rectangular prism, a cylinder, a taper or a dovetailed shape andany irregular shape are protected in the present invention.

Referring to FIG. 6, the difference between the sixth embodiment and theabove-mentioned embodiments is that: in the sixth embodiment, theheat-dissipating fins 20 f are integratedly disposed on one part (thefirst surface F1) of a top surface of the hollow heat-dissipating body10 f, and another part (the second surface F2) of the top surface of thehollow heat-dissipating body 10 f provides a space for receiving atleast one heat-generating element Hf. In other words, the hollowheat-dissipating body 10 f provides the second surface F2, so that theheat-generating element Hf is smoothly disposed on the second surface F2(heat-dissipating paste can be filled between the heat-generatingelement Hf and the second surface F2 extra) in order to increaseheat-conducting efficiency. Hence, heat generated from theheat-generating element Hf may be absorbed by the second surface F2, andthe heat is dissipated by the heat-dissipating fins 20 f that are formedon the first surface F1.

Referring to FIG. 7, the difference between the seventh embodiment andthe above-mentioned embodiments is that: the seventh embodiment furtherincludes at least one third heat-dissipating unit 3 g having aheat-dissipating body 30 g, a plurality of heat-dissipating fins 31 gextended upwards from the heat-dissipating body 30 g, and a plurality ofdovetailed retaining bodies 32 g extended downwards from theheat-dissipating body 30 g. The third heat-dissipating unit 3 g isretained on the second heat-dissipating unit 2 g by matching thedovetailed retaining bodies 32 g and the dovetailed heat-dissipatingfins 20 g.

In addition, the second heat-dissipating unit 2 g is integratedlydisposed on one part (the first partial surface G1) of a top surface ofthe hollow heat-dissipating body 10 g, and another part (the secondpartial surface G2) of the top surface of the hollow heat-dissipatingbody 10 g is one end surface of the hollow heat-dissipating body 10 g toprovide a space for receiving at least one heat-generating element Hg,and the third heat-dissipating unit 3 g is disposed over other endsurface of the hollow heat-dissipating body 10 g.

Referring to FIG. 8, the difference between the eighth embodiment andthe above-mentioned embodiments is that: the eighth embodiment furtherincludes at least one third heat-dissipating unit 3 h having aheat-dissipating body 30 h, a plurality of heat-dissipating fins 31 hextended upwards from the heat-dissipating body 30 h, and a plurality ofdovetailed retaining bodies 32 h extended downwards from theheat-dissipating body 30 h. The third heat-dissipating unit 3 h isretained on the second heat-dissipating unit 2 h by matching thedovetailed retaining bodies 32 h and the dovetailed heat-dissipatingfins 20 h.

In addition, the second heat-dissipating unit 2 h is integratedlydisposed on a top surface (the whole top surface H) of the hollowheat-dissipating body 10 h, so that at least one heat-generating elementHh with a dovetailed bottom seat Bh is retained on one end surface ofthe second heat-dissipating unit 2 h, and the third heat-dissipatingunit 3 h is retained on another opposite end surface of the secondheat-dissipating unit 2 h.

Referring to FIG. 9, the difference between the ninth embodiment and theabove-mentioned embodiments is that: the ninth embodiment furtherincludes at least two third heat-dissipating units 3 i. Each thirdheat-dissipating unit 3 i has a heat-dissipating body 30 i, a pluralityof heat-dissipating fins 31 i extended upwards from the heat-dissipatingbody 30 i, and a plurality of dovetailed retaining bodies 32 i extendeddownwards from the heat-dissipating body 30 i. Hence, the two thirdheat-dissipating units 3 i are retained on the second heat-dissipatingunit 2 i by matching the dovetailed retaining bodies 32 i and thedovetailed heat-dissipating fins 20 i.

In addition, the second heat-dissipating unit 2 i is integratedlydisposed on one part (the first surface I1) of a top surface of thehollow heat-dissipating body 10 i, and another part (the second surfaceI2) of the top surface of the hollow heat-dissipating body 10 i isposition on a central area of the first heat-dissipating unit 1 i toprovide a space for receiving at least one heat-generating element Hi,and the two third heat-dissipating units 3 i are respectively disposedover two opposite end surfaces of the hollow heat-dissipating body 1 i.

Referring to FIGS. 10A to 10D, the first embodiment is an example; thepresent invention provides a method for manufacturing a plane-typeheat-dissipating structure with high heat-dissipating effect. The methodincludes the following steps:

Step S100 is that: using an extruding mold M to integratedly extrude afirst heat-dissipating unit 1 a and a second heat-dissipating unit 2 a;wherein the first heat-dissipating unit 1 a has a hollowheat-dissipating body 10 a, a plurality of supports 11 a integratedlyformed in the hollow heat-dissipating body 10 a in order to divide aninner space of the hollow heat-dissipating body 10 a into a plurality ofreceiving spaces 100 a, and a plurality of microstructures 12 aintegratedly formed on an inner surface of the hollow heat-dissipatingbody 10 a, and the second heat-dissipating unit 2 a is integratedlyformed on an outer surface of the first heat-dissipating unit 1 a.

Referring to FIG. 10B, the extruding mold M is composed of a mold bodyM1 and a spindle M2. The mold body M1 has a plurality of protrusionportions M10 disposed on an inner wall thereof, and the spindle M2 has aforming portion M20 extending forwards from one end thereof. Inaddition, the protrusion portions M10 can be used to extrude toothshape, and the protrusion portions M10 are manufactured by contactfabrication or noncontact fabrication, for example, electro-chemistry(such as etching, electroforming, electro-discharge machining, and CNCwire cutting) and energy bundle processing (such as laser with differentwavelength, electronic beam, and ultrasonic machining).

Referring to FIG. 10C, the forming portion M20 has a plurality ofextending bodies M200 connected to the spindle M2 and extendingforwards. There are many gaps G respectively formed between every twoextending bodies M200. Each extending body M200 has a plurality of microprotrusions M2000 disposed on a top surface and a bottom surfacethereof.

Referring to FIGS. 10B to 10D, the first heat-dissipating unit 1 a andthe second heat-dissipating unit 2 a are integratedly extruded bymatching the protrusion portions M10 of the mold body M1 and the microprotrusions M2000 of the forming portion M20.

Step S102 is that: closing one end of the first heat-dissipating unit 1a.

Step S104 is that: filling work liquid (not shown) into the receivingspaces 100 a.

Step S106 is that: extracting air from the receiving spaces 100 a andclosing other opposite end of the first heat-dissipating unit 1 a tomake the hollow heat-dissipating body 10a become an evacuated hollowheat-dissipating body 10 a.

In conclusion, the present invention has the following advantages:

1. The work liquid may generate capillarity by the design of themicrostructures, so that the work liquid may flow back quickly to aheat-generating area to absorb heat. The microstructures can be anyregular shapes (such as rectangular prism, a cylinder, a taper or adovetailed shape) and any irregular shape according to different designrequirement.

2. Each heat-dissipating fin has a rectangular prism, a cylinder, ataper or a dovetailed shape according to different design requirement.

3. The hollow heat-dissipating body provides the second surface, so thatthe heat-generating element is smoothly disposed on the second surfacein order to increase heat-conducting efficiency. Hence, heat generatedfrom the heat-generating element may be absorbed by the second surface,and the heat is dissipated by the heat-dissipating fins that are formedon the first surface.

4. The third heat-dissipating unit is retained on the secondheat-dissipating unit by matching the dovetailed retaining bodies of thethird heat-dissipating unit and the dovetailed heat-dissipating fins ofthe second heat-dissipating unit.

5. The heat-generating element is retained on the secondheat-dissipating unit by matching the dovetailed bottom seat of theheat-generating element and the dovetailed heat-dissipating fins of thesecond heat-dissipating unit.

The above-mentioned descriptions represent merely the preferredembodiment of the present invention, without any intention to limit thescope of the present invention thereto. Various equivalent changes,alternations or modifications based on the claims of present inventionare all consequently viewed as being embraced by the scope of thepresent invention.

1. A plane-type heat-dissipating structure with high heat-dissipatingeffect, comprising: a first heat-dissipating unit having an evacuatedhollow heat-dissipating body, a plurality of supports integratedlyformed in the hollow heat-dissipating body in order to divide an innerspace of the hollow heat-dissipating body into a plurality of receivingspaces, and a plurality of microstructures integratedly formed on aninner surface of the hollow heat-dissipating body, wherein work liquidis filled into the receiving spaces; and a second heat-dissipating unitintegratedly formed on an outer surface of the first heat-dissipatingunit.
 2. The plane-type heat-dissipating structure according to claim 1,wherein the first heat-dissipating unit and the second heat-dissipatingunit are made of aluminum alloy.
 3. The plane-type heat-dissipatingstructure according to claim 1, wherein the first heat-dissipating unithas a plurality of grooves formed in the receiving spaces, each grooveis between every two adjacent microstructures, and each microstructurehas a rectangular prism, a cylinder, a taper or a dovetailed shape. 4.The plane-type heat-dissipating structure according to claim 1, whereinthe second heat-dissipating unit has a plurality of heat-dissipatingfins.
 5. The plane-type heat-dissipating structure according to claim 4,wherein the heat-dissipating fins are integratedly disposed on one partof a top surface of the hollow heat-dissipating body, and another partof the top surface of the hollow heat-dissipating body provides a spacefor receiving at least one heat-generating element.
 6. The plane-typeheat-dissipating structure according to claim 4, wherein eachheat-dissipating fin has a rectangular prism, a cylinder, a taper or adovetailed shape.
 7. The plane-type heat-dissipating structure accordingto claim 6, further comprising: at least one third heat-dissipating unithaving a heat-dissipating body, a plurality of heat-dissipating finsextended upwards from the heat-dissipating body, and a plurality ofdovetailed retaining bodies extended downwards from the heat-dissipatingbody, wherein the third heat-dissipating unit is retained on the secondheat-dissipating unit by matching the dovetailed retaining bodies andthe dovetailed heat-dissipating fins.
 8. The plane-type heat-dissipatingstructure according to claim 7, wherein the second heat-dissipating unitis integratedly disposed on one part of a top surface of the hollowheat-dissipating body, and another part of the top surface of the hollowheat-dissipating body is one end surface of the hollow heat-dissipatingbody to provide a space for receiving at least one heat-generatingelement, and the third heat-dissipating unit is disposed over other endsurface of the hollow heat-dissipating body.
 9. The plane-typeheat-dissipating structure according to claim 7, wherein the secondheat-dissipating unit is integratedly disposed on a top surface of thehollow heat-dissipating body, so that at least one heat-generatingelement with a dovetailed bottom seat is retained on one end surface ofthe second heat-dissipating unit, and the third heat-dissipating unit isretained on another opposite end surface of the second heat-dissipatingunit.
 10. The plane-type heat-dissipating structure according to claim1, further comprising: at least two third heat-dissipating units,wherein each third heat-dissipating unit has a heat-dissipating body, aplurality of heat-dissipating fins extended upwards from theheat-dissipating body, and a plurality of dovetailed retaining bodiesextended downwards from the heat-dissipating body, wherein the thirdheat-dissipating unit is retained on the second heat-dissipating unit bymatching the dovetailed retaining bodies and the dovetailedheat-dissipating fins, wherein the second heat-dissipating unit isintegratedly disposed on one part of a top surface of the hollowheat-dissipating body, and another part of the top surface of the hollowheat-dissipating body is position on a central area of the firstheat-dissipating unit to provide a space for receiving at least oneheat-generating element, and the two third heat-dissipating units arerespectively disposed over two opposite end surfaces of the hollowheat-dissipating body.
 11. A method for manufacturing a plane-typeheat-dissipating structure with high heat-dissipating effect,comprising: using an extruding mold to integratedly extrude a firstheat-dissipating unit and a second heat-dissipating unit, wherein thefirst heat-dissipating unit has a hollow heat-dissipating body, aplurality of supports integratedly formed in the hollow heat-dissipatingbody in order to divide an inner space of the hollow heat-dissipatingbody into a plurality of receiving spaces, and a plurality ofmicrostructures integratedly formed on an inner surface of the hollowheat-dissipating body, and the second heat-dissipating unit isintegratedly formed on an outer surface of the first heat-dissipatingunit; closing one end of the first heat-dissipating unit; filling workliquid into the receiving spaces; and extracting air from the receivingspaces and closing other opposite end of the first heat-dissipating unitto make the hollow heat-dissipating body become an evacuated hollowheat-dissipating body.
 12. The method according to claim 11, wherein theextruding mold is composed of a mold body and a spindle, the mold bodyhas a plurality of protrusion portions disposed on an inner wallthereof, the spindle has a forming portion extending forwards from oneend thereof, and the first heat-dissipating unit and the secondheat-dissipating unit are integratedly extruded by matching theprotrusion portions and the forming portion.
 13. The method according toclaim 12, wherein the forming portion has a plurality of extendingbodies connected to the spindle and extending forwards, many gapsrespectively formed between every two extending bodies, and eachextending body has a plurality of micro protrusions disposed on a topsurface and a bottom surface thereof.
 14. The method according to claim11, wherein the first heat-dissipating unit has a plurality of groovesformed in the receiving spaces, each groove is between every twoadjacent microstructures, and each microstructure has a rectangularprism, a cylinder, a taper or a dovetailed shape.
 15. The methodaccording to claim 11, wherein the second heat-dissipating unit has aplurality of heat-dissipating fins, and each heat-dissipating fin has arectangular prism, a cylinder, a taper or a dovetailed shape.
 16. Themethod according to claim 15, wherein the heat-dissipating fins areintegratedly disposed on one part of a top surface of the hollowheat-dissipating body, and another part of the top surface of the hollowheat-dissipating body provides a space for receiving at least oneheat-generating element.
 17. The method according to claim 16, furthercomprising: at least one third heat-dissipating unit having aheat-dissipating body, a plurality of heat-dissipating fins extendedupwards from the heat-dissipating body, and a plurality of dovetailedretaining bodies extended downwards from the heat-dissipating body,wherein the third heat-dissipating unit is retained on the secondheat-dissipating unit by matching the dovetailed retaining bodies andthe dovetailed heat-dissipating fins.
 18. The method according to claim17, wherein the second heat-dissipating unit is integratedly disposed onone part of a top surface of the hollow heat-dissipating body, andanother part of the top surface of the hollow heat-dissipating body isone end surface of the hollow heat-dissipating body to provide a spacefor receiving at least one heat-generating element, and the thirdheat-dissipating unit is disposed over other end surface of the hollowheat-dissipating body.
 19. The method according to claim 17, wherein thesecond heat-dissipating unit is integratedly disposed on a top surfaceof the hollow heat-dissipating body, so that at least oneheat-generating element with a dovetailed bottom seat is retained on oneend surface of the second heat-dissipating unit, and the thirdheat-dissipating unit is retained on another opposite end surface of thesecond heat-dissipating unit.
 20. The plane-type heat-dissipatingstructure according to claim 11, further comprising: at least two thirdheat-dissipating units, wherein each third heat-dissipating unit has aheat-dissipating body, a plurality of heat-dissipating fins extendedupwards from the heat-dissipating body, and a plurality of dovetailedretaining bodies extended downwards from the heat-dissipating body,wherein the third heat-dissipating unit is retained on the secondheat-dissipating unit by matching the dovetailed retaining bodies andthe dovetailed heat-dissipating fins, wherein the secondheat-dissipating unit is integratedly disposed on one part of a topsurface of the hollow heat-dissipating body, and another part of the topsurface of the hollow heat-dissipating body is position on a centralarea of the first heat-dissipating unit to provide a space for receivingat least one heat-generating element, and the two third heat-dissipatingunits are respectively disposed over two opposite end surfaces of thehollow heat-dissipating body.